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Cu-Cu Bonding using Optimized Copper Nitride Passivation fo..:

, In: 2021 IEEE International Interconnect Technology Conference (IITC),
Park, Haesung ; Park, Seungmin ; Kim, Yoonho. - p. 1-2 , 2021
Link: https://doi.org/10.1109/IITC51362.2021.9537344