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1 Ergebnisse
1
Advanced Air Gap Formation Scheme Using Volatile Material:
, In:
2021 IEEE International Interconnect Technology Conference (IITC)
,
Warashina, H.
;
Kawasaki, H.
;
Nagai, H.
... - p. 1-3 , 2021
Link:
https://doi.org/10.1109/IITC51362.2021.9537549
RT T1
2021 IEEE International Interconnect Technology Conference (IITC)
: T1
Advanced Air Gap Formation Scheme Using Volatile Material
UL https://suche.suub.uni-bremen.de/peid=ieee-9537549&Exemplar=1&LAN=DE A1 Warashina, H. A1 Kawasaki, H. A1 Nagai, H. A1 Yamaguchi, T. A1 Sato, N. A1 Kikuchi, Y. A1 Sun, X. YR 2021 SN 2380-6338 K1 Conferences K1 Air gaps K1 Lithography K1 Capacitance K1 Delays K1 Novel air gap formation scheme K1 Volatile material K1 Capacitance reduction K1 Lithography-less K1 Subtractive interconnect SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IITC51362.2021.9537549 DO https://doi.org/10.1109/IITC51362.2021.9537549 SF ELIB - SuUB Bremen
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