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1 Ergebnisse
1
Signal Integrity Design Methodology for Package in Co-packa..:
, In:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium
,
Pu, Bo
;
He, Jiayi
;
Harmon, Aaron
... - p. 492-497 , 2021
Link:
https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021...
RT T1 <cTitle>2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium</cTitle>: T1 <Title>Signal Integrity Design Methodology for Package in Co-packaged Optics Based on Figure of Merit as Channel Operating Margin</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9559168&Exemplar=1&LAN=DE A1 Pu, Bo A1 He, Jiayi A1 Harmon, Aaron A1 Guo, Yuandong A1 Liu, Yuanzhuo A1 Cai, Qiangming YR 2021 K1 Optical losses K1 Integrated optics K1 Three-dimensional displays K1 Design methodology K1 Layout K1 Crosstalk K1 Predictive models K1 channel operating margin (COM) K1 co-packaged optics (CPO) K1 design methodology K1 ethernet K1 figure of merit K1 high speed K1 insertion loss K1 integrated crosstalk noise (ICN) K1 package design K1 signal integrity SP 492 OP 497 LK http://dx.doi.org/https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559168 DO https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559168 SF ELIB - SuUB Bremen
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