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1 Ergebnisse
1
Design and Analysis of On-package Inductor of an Integrated..:
, In:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium
,
Kim, Subin
;
Jeong, Seungtaek
;
Sim, Boogyo
... - p. 498-503 , 2021
Link:
https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021...
RT T1 <cTitle>2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium</cTitle>: T1 <Title>Design and Analysis of On-package Inductor of an Integrated Voltage Regulator for High-Q Factor and EMI Shielding in Active Interposer based 2.5D/3D ICs</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9559188&Exemplar=1&LAN=DE A1 Kim, Subin A1 Jeong, Seungtaek A1 Sim, Boogyo A1 Lee, Seongsoo A1 Park, Hyunwook A1 Kim, Haeyeon A1 Kim, Joungho YR 2021 K1 Couplings K1 Regulators K1 Spirals K1 Frequency-domain analysis K1 Electromagnetic interference K1 Metals K1 Magnetic noise K1 inductor K1 package K1 inductive noise coupling K1 active interposer K1 integrated voltage regulator SP 498 OP 503 LK http://dx.doi.org/https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559188 DO https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559188 SF ELIB - SuUB Bremen
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