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1 Ergebnisse
1
The Study of Effects to the Thermo-Mechanical Performance o..:
, In:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Zhenyu
;
Ren, Linlin
;
Zeng, Xiangliang
... - p. 1-6 , 2021
Link:
https://doi.org/10.1109/ICEPT52650.2021.9567919
RT T1 <cTitle>2021 22nd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>The Study of Effects to the Thermo-Mechanical Performance of the First Level Thermal Interface Materials</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9567919&Exemplar=1&LAN=DE A1 Wang, Zhenyu A1 Ren, Linlin A1 Zeng, Xiangliang A1 Ye, Wenbo A1 Xu, Yonglun A1 Zeng, Xiaoliang A1 Pang, YunSong A1 Rong, Sun YR 2021 K1 Industries K1 Thermal management of electronics K1 Performance evaluation K1 Thermal expansion K1 Tensile stress K1 Thermal resistance K1 Plastics K1 silicones K1 gap pads K1 strain recovery K1 creep K1 stress relaxation SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT52650.2021.9567919 DO https://doi.org/10.1109/ICEPT52650.2021.9567919 SF ELIB - SuUB Bremen
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