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The multi-dimension co-design for the package of the high-s..:
, In:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
,
Guan, Yuan
;
Wang, Yubo
;
Li, Dejian
... - p. 1-6 , 2021
Link:
https://doi.org/10.1109/ICEPT52650.2021.9567950
RT T1 <cTitle>2021 22nd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>The multi-dimension co-design for the package of the high-speed multi-function chip</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9567950&Exemplar=1&LAN=DE A1 Guan, Yuan A1 Wang, Yubo A1 Li, Dejian A1 Han, Shunfeng A1 Li, Bofu A1 Li, Dameng A1 Liu, Fengman A1 He, Huimin YR 2021 K1 Temperature distribution K1 Time-frequency analysis K1 Wires K1 Voltage K1 Registers K1 Pins K1 Bonding K1 multi-function chip K1 multi-dimension co-design method K1 electrical/thermal co-design SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT52650.2021.9567950 DO https://doi.org/10.1109/ICEPT52650.2021.9567950 SF ELIB - SuUB Bremen
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