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1 Ergebnisse
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Influence of IMC morphology on fatigue stress, strain and l..:
, In:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
,
Yang, Guang
;
Wu, Fengshun
;
Zhou, Longzao
... - p. 1-5 , 2021
Link:
https://doi.org/10.1109/ICEPT52650.2021.9567955
RT T1
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Influence of IMC morphology on fatigue stress, strain and life of solder layer between SiC chip and DBC substrate in IGBT under thermal cycling
UL https://suche.suub.uni-bremen.de/peid=ieee-9567955&Exemplar=1&LAN=DE A1 Yang, Guang A1 Wu, Fengshun A1 Zhou, Longzao A1 Luan, Xinghe A1 Zou, Xinrui A1 Liu, Hui A1 Wan, Yang A1 Zhang, Xiaowei A1 Wang, Bin YR 2021 K1 Insulated gate bipolar transistors K1 Silicon carbide K1 Morphology K1 Fatigue K1 Finite element analysis K1 Plastics K1 Stress K1 SiC based IGBT K1 IMC morphology K1 thermal fatigue simulation SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT52650.2021.9567955 DO https://doi.org/10.1109/ICEPT52650.2021.9567955 SF ELIB - SuUB Bremen
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