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1 Ergebnisse
1
Study on the Electromagnetic and Thermal Characteristics of..:
, In:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
,
Zhao, Chen
;
Lezhi, Ye
;
Xuanjie, Song
... - p. 1-6 , 2021
Link:
https://doi.org/10.1109/ICEPT52650.2021.9568075
RT T1 <cTitle>2021 22nd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Study on the Electromagnetic and Thermal Characteristics of Aerostatic Spindle for Wafer Grinding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9568075&Exemplar=1&LAN=DE A1 Zhao, Chen A1 Lezhi, Ye A1 Xuanjie, Song A1 Zhiyue, Wang A1 Guangjie, Liu A1 Yumin, Zhao YR 2021 K1 Shafts K1 Couplings K1 Temperature distribution K1 Analytical models K1 Torque K1 Thermal analysis K1 Magnetic analysis K1 Wafer grinding K1 aerostatic spindle K1 thermal analysis K1 electromagnetic analysis SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT52650.2021.9568075 DO https://doi.org/10.1109/ICEPT52650.2021.9568075 SF ELIB - SuUB Bremen
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