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1 Ergebnisse
1
Thermomechanical and Electrical Properties of the $\text{Si..:
, In:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
,
Li, Chaofan
;
Luo, Suibin
;
Yu, Shuhui
.. - p. 1-5 , 2021
Link:
https://doi.org/10.1109/ICEPT52650.2021.9568088
RT T1 <cTitle>2021 22nd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Thermomechanical and Electrical Properties of the $\text{SiO}_{2}/\text{ZrW}_{2}\mathrm{O}_{8}/\text{Epoxy}$ Composite</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9568088&Exemplar=1&LAN=DE A1 Li, Chaofan A1 Luo, Suibin A1 Yu, Shuhui A1 Chu, Baojin A1 Sun, Rong YR 2021 K1 Silicon compounds K1 Thermal expansion K1 Dielectric constant K1 Powders K1 Printed circuits K1 Thermomechanical processes K1 Dielectric losses K1 Low thermal expansion coefficient K1 Low dielectric constant K1 Low dielectric loss K1 Epoxy composite material SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT52650.2021.9568088 DO https://doi.org/10.1109/ICEPT52650.2021.9568088 SF ELIB - SuUB Bremen
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