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1 Ergebnisse
1
Underfill Filler Settling Effect on the Adhesive Force of F..:
, In:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
,
Zhao, Guolin
;
Wu, Houya
;
Yang, Yuanyuan
... - p. 1-5 , 2021
Link:
https://doi.org/10.1109/ICEPT52650.2021.9568118
RT T1
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Underfill Filler Settling Effect on the Adhesive Force of Flip Chip Packages
UL https://suche.suub.uni-bremen.de/peid=ieee-9568118&Exemplar=1&LAN=DE A1 Zhao, Guolin A1 Wu, Houya A1 Yang, Yuanyuan A1 Li, Gang A1 Zhu, Pengli A1 Sun, Rong A1 Zhu, Wenhui YR 2021 K1 Temperature measurement K1 Thermal expansion K1 Adhesive strength K1 Force K1 Tin K1 Packaging K1 Flip-chip devices K1 underfill K1 filler settlement K1 adhesive force K1 advanced packaging materials SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT52650.2021.9568118 DO https://doi.org/10.1109/ICEPT52650.2021.9568118 SF ELIB - SuUB Bremen
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