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1 Ergebnisse
1
The Effect of Toughening Agents on Capillary Underfill in t..:
, In:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
,
Yang, Yuanyuan
;
Wu, Houya
;
Peng, Tao
... - p. 1-5 , 2021
Link:
https://doi.org/10.1109/ICEPT52650.2021.9568119
RT T1 <cTitle>2021 22nd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>The Effect of Toughening Agents on Capillary Underfill in the Flip Chip Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9568119&Exemplar=1&LAN=DE A1 Yang, Yuanyuan A1 Wu, Houya A1 Peng, Tao A1 Yang, Jinbao A1 Wang, Bin A1 Lin, Haoliang A1 Li, Gang A1 Zhu, Pengli A1 Sun, Rong YR 2021 K1 Viscosity K1 Thermal expansion K1 Adhesives K1 Absorption K1 Moisture K1 Curing K1 Rubber K1 Flip-chip K1 Capillary underfill K1 Toughening agents SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT52650.2021.9568119 DO https://doi.org/10.1109/ICEPT52650.2021.9568119 SF ELIB - SuUB Bremen
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