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1 Ergebnisse
1
Microstructure and mechanical characteristics of a novel Cu..:
, In:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
,
Xu, Hongyan
;
Zhang, Wei
;
Liu, Xuan
. - p. 1-6 , 2021
Link:
https://doi.org/10.1109/ICEPT52650.2021.9568144
RT T1
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Microstructure and mechanical characteristics of a novel Cu/Cu3Sn joint with Cu/Sn preform
UL https://suche.suub.uni-bremen.de/peid=ieee-9568144&Exemplar=1&LAN=DE A1 Xu, Hongyan A1 Zhang, Wei A1 Liu, Xuan A1 Xu, Ju YR 2021 K1 Transmission line matrix methods K1 Three-dimensional displays K1 Preforms K1 Metals K1 Thermal analysis K1 Coatings K1 Microstructure K1 Coating layer thickness K1 Shear strength K1 Theoretical calculation K1 Activation energy K1 Fracture mechanism SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT52650.2021.9568144 DO https://doi.org/10.1109/ICEPT52650.2021.9568144 SF ELIB - SuUB Bremen
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