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1 Ergebnisse
1
Influences of the Solder Size on Growth of Interfacial CU6S..:
, In:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
,
Chen, Ming-Qiang
;
Zhou, Min-Bo
;
Li, Yun-Wei
. - p. 1-5 , 2021
Link:
https://doi.org/10.1109/ICEPT52650.2021.9568180
RT T1 <cTitle>2021 22nd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Influences of the Solder Size on Growth of Interfacial CU6Sn5 and Mechanical Performance of Sn-3.0Ag-0.5Cu/(111)Cu Joints Subjected to Multiple Reflow Soldering</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9568180&Exemplar=1&LAN=DE A1 Chen, Ming-Qiang A1 Zhou, Min-Bo A1 Li, Yun-Wei A1 Zhang, Xin-Ping YR 2021 K1 Grain size K1 Grain boundaries K1 Micrometers K1 Three-dimensional displays K1 Morphology K1 Materials reliability K1 Packaging K1 Heterogeneous integration K1 Micro-bump solder size effect K1 Intermetallic compound K1 Monocrystalline Cu K1 Multiple reflow SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT52650.2021.9568180 DO https://doi.org/10.1109/ICEPT52650.2021.9568180 SF ELIB - SuUB Bremen
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