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1 Ergebnisse
1
Mechanical Behavior of Lead-free Solder at High Temperature..:
, In:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
,
Long, Xu
;
Su, Tianxiong
;
Chang, Chao
... - p. 1-4 , 2021
Link:
https://doi.org/10.1109/ICEPT52650.2021.9568200
RT T1 <cTitle>2021 22nd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9568200&Exemplar=1&LAN=DE A1 Long, Xu A1 Su, Tianxiong A1 Chang, Chao A1 Huang, Jiaqiang A1 Chang, Xiaotong A1 Su, Yutai A1 Shi, Hongbin A1 Huang, Tao A1 Wu, Yanpei YR 2021 K1 Performance evaluation K1 Temperature dependence K1 Temperature K1 Lead K1 Packaging K1 Optical reflection K1 Soldering K1 Dynamic K1 SHPB K1 strain rate K1 temperature K1 microstructure SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT52650.2021.9568200 DO https://doi.org/10.1109/ICEPT52650.2021.9568200 SF ELIB - SuUB Bremen
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