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1 Ergebnisse
1
Thermal Design Comparison of Various Natural Convection Coo..:
, In:
2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe)
,
Rode, Sebastian
;
Weis, Robin
;
Schwingal, Normann
. - p. P.1-P.9 , 2021
Link:
https://doi.org/10.23919/EPE21ECCEEurope50061.2021.957..
RT T1 <cTitle>2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe)</cTitle>: T1 <Title>Thermal Design Comparison of Various Natural Convection Cooling Concepts of Discrete SiC-MOSFETs</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9570536&Exemplar=1&LAN=DE A1 Rode, Sebastian A1 Weis, Robin A1 Schwingal, Normann A1 Bernet, Steffen YR 2021 K1 Resistance K1 Analytical models K1 Semiconductor device measurement K1 Costs K1 Cooling K1 Thermal resistance K1 Electronic packaging thermal management K1 ≪Cooling≫ K1 ≪Natural Convection≫ K1 ≪Thermal design≫ K1 ≪Silicon Carbide (SiC)≫ K1 ≪High power discrete device≫ SP P.1 OP P.9 LK http://dx.doi.org/https://doi.org/10.23919/EPE21ECCEEurope50061.2021.9570536 DO https://doi.org/10.23919/EPE21ECCEEurope50061.2021.9570536 SF ELIB - SuUB Bremen
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