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Crack tip behavior under pulsed electro-magnetic loading:
, In:
IEEE Conference Record - Abstracts. PPPS-2001 Pulsed Power Plasma Science 2001. 28th IEEE International Conference on Plasma Science and 13th IEEE International Pulsed Power Conference (Cat. No.01CH37
,
Satapathy, S.
;
Stefani, F.
- p. 262 , 2001
Link:
https://doi.org/10.1109/PPPS.2001.960897
RT T1
IEEE Conference Record - Abstracts. PPPS-2001 Pulsed Power Plasma Science 2001. 28th IEEE International Conference on Plasma Science and 13th IEEE International Pulsed Power Conference (Cat. No.01CH37
: T1
Crack tip behavior under pulsed electro-magnetic loading
UL https://suche.suub.uni-bremen.de/peid=ieee-960897&Exemplar=1&LAN=DE A1 Satapathy, S. A1 Stefani, F. YR 2001 K1 Conducting materials K1 Resistance heating K1 Thermal conductivity K1 Pulsed power supplies K1 Optical microscopy K1 Current density K1 Temperature K1 Electric resistance K1 Thermal resistance K1 Mechanical factors SP 262 LK http://dx.doi.org/https://doi.org/10.1109/PPPS.2001.960897 DO https://doi.org/10.1109/PPPS.2001.960897 SF ELIB - SuUB Bremen
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