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Modeling Finite Dielectric Structures Embedded in Layered M..:

, In: 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Bianconi, Giacomo ; Chakraborty, Swagato - p. 1-3 , 2021
Link: https://doi.org/10.1109/EPEPS51341.2021.9609116