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1 Ergebnisse
1
Modeling and Signal Integrity Analysis of Mounting Pad with..:
, In:
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
,
Kim, Hyunwoong
;
Kim, Jongwook
;
Song, Kyunghwan
... - p. 1-3 , 2021
Link:
https://doi.org/10.1109/EPEPS51341.2021.9609162
RT T1 <cTitle>2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)</cTitle>: T1 <Title>Modeling and Signal Integrity Analysis of Mounting Pad with Layer-cutting to reduce Impedance Mismatch for Dual-In-Line Memory Module (DIMM)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9609162&Exemplar=1&LAN=DE A1 Kim, Hyunwoong A1 Kim, Jongwook A1 Song, Kyunghwan A1 Lee, Seonghi A1 Kim, Keunwoo A1 Kim, Seongguk A1 Lho, Daehwan A1 Kim, Hyunsik A1 Park, Minho A1 Ahn, Seungyoung YR 2021 SN 2165-4115 K1 Analytical models K1 Impedance matching K1 System performance K1 Insertion loss K1 Memory modules K1 Capacitance K1 Microstrip components K1 Dual-in-line-memory-module (DIMM) K1 Impeda-n ce matching K1 Layer-cutting method K1 Modeling K1 Mounting pad SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EPEPS51341.2021.9609162 DO https://doi.org/10.1109/EPEPS51341.2021.9609162 SF ELIB - SuUB Bremen
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