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1 Ergebnisse
1
Atmospheric Pressure Plasma Surface Treatment for Solderabi..:
, In:
2020 IEEE International Conference on Plasma Science (ICOPS)
,
Kencana, Sagung Dewi
;
Kuo, Yu-Lin
;
Changraini, Clarissa
... - p. 578-578 , 2020
Link:
https://doi.org/10.1109/ICOPS37625.2020.9717937
RT T1 <cTitle>2020 IEEE International Conference on Plasma Science (ICOPS)</cTitle>: T1 <Title>Atmospheric Pressure Plasma Surface Treatment for Solderability Enhancement on Printed Circuit Boards</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9717937&Exemplar=1&LAN=DE A1 Kencana, Sagung Dewi A1 Kuo, Yu-Lin A1 Changraini, Clarissa A1 Yen, Yee-Wen A1 Schellkes, Eckart A1 Chuang, Wallace YR 2020 SN 2576-7208 K1 Surface contamination K1 Impurities K1 Printed circuits K1 Metals K1 Integrated circuit interconnections K1 Packaging K1 Plasmas SP 578 OP 578 LK http://dx.doi.org/https://doi.org/10.1109/ICOPS37625.2020.9717937 DO https://doi.org/10.1109/ICOPS37625.2020.9717937 SF ELIB - SuUB Bremen
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