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3D Sequential Process Integration for CMOS Image Sensor:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Nakazawa, K. ; Yamamoto, J. ; Mori, S.... - p. 30.4.1-30.4.4 , 2021
Link: https://doi.org/10.1109/IEDM19574.2021.9720563