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1 Ergebnisse
1
Fully Self-Aligned Via Integration for Interconnect Scaling..:
, In:
2021 IEEE International Electron Devices Meeting (IEDM)
,
Chen, H.P.
;
Wu, Y.H.
;
Huang, H.Y.
... - p. 22.1.1-22.1.4 , 2021
Link:
https://doi.org/10.1109/IEDM19574.2021.9720600
RT T1
2021 IEEE International Electron Devices Meeting (IEDM)
: T1
Fully Self-Aligned Via Integration for Interconnect Scaling Beyond 3nm Node
UL https://suche.suub.uni-bremen.de/peid=ieee-9720600&Exemplar=1&LAN=DE A1 Chen, H.P. A1 Wu, Y.H. A1 Huang, H.Y. A1 Tsai, C.H. A1 Lee, S.K. A1 Lee, C.C. A1 Wei, T.H. A1 Yao, H.C. A1 Wang, Y.C. A1 Liao, C.Y. A1 Chang, H.K. A1 Lu, C.W. A1 Shue, Winston S. A1 Cao, Min YR 2021 SN 2156-017X K1 Inhibitors K1 Surface resistance K1 Metals K1 Surface roughness K1 US Department of Defense K1 Surface topography K1 Rough surfaces SP 22.1.1 OP 22.1.4 LK http://dx.doi.org/https://doi.org/10.1109/IEDM19574.2021.9720600 DO https://doi.org/10.1109/IEDM19574.2021.9720600 SF ELIB - SuUB Bremen
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