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Reliability Characterization for Advanced DRAM using HK/MG ..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Lee, S. ; Kim, G.-J. ; Lee, N-H.... - p. 6.6.1-6.6.4 , 2021
Link: https://doi.org/10.1109/IEDM19574.2021.9720613