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3D SoC integration, beyond 2.5D chiplets:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Beyne, Eric ; Milojevic, Dragomir ; Van der Plas, Geert. - p. 3.6.1-3.6.4 , 2021
Link: https://doi.org/10.1109/IEDM19574.2021.9720614