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Inspection and metrology challenges for 3 nm node devices a..:
, In:
2021 IEEE International Electron Devices Meeting (IEDM)
,
Shohjoh, T.
;
Ikota, M.
;
Isawa, M.
... - p. 3.3.1-3.3.4 , 2021
Link:
https://doi.org/10.1109/IEDM19574.2021.9720711
RT T1
2021 IEEE International Electron Devices Meeting (IEDM)
: T1
Inspection and metrology challenges for 3 nm node devices and beyond
UL https://suche.suub.uni-bremen.de/peid=ieee-9720711&Exemplar=1&LAN=DE A1 Shohjoh, T. A1 Ikota, M. A1 Isawa, M. A1 Lorusso, G. F. A1 Horiguchi, N. A1 Briggs, B. A1 Mertens, H. A1 Bogdanowicz, J. A1 De Bisschop, P. A1 Charley, A.-L. YR 2021 SN 2156-017X K1 Scanning electron microscopy K1 Electric potential K1 Metrology K1 Inspection K1 Tin K1 Dielectric measurement K1 Dielectrics SP 3.3.1 OP 3.3.4 LK http://dx.doi.org/https://doi.org/10.1109/IEDM19574.2021.9720711 DO https://doi.org/10.1109/IEDM19574.2021.9720711 SF ELIB - SuUB Bremen
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