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1 Ergebnisse
1
Q-V Modal Analysis Considering Electro-thermal Coupling:
, In:
2022 IEEE 6th Information Technology and Mechatronics Engineering Conference (ITOEC)
,
Peng, Jing
;
Li, Biao
;
Qi, Fujun
... - p. 1267-1271 , 2022
Link:
https://doi.org/10.1109/ITOEC53115.2022.9734624
RT T1 <cTitle>2022 IEEE 6th Information Technology and Mechatronics Engineering Conference (ITOEC)</cTitle>: T1 <Title>Q-V Modal Analysis Considering Electro-thermal Coupling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9734624&Exemplar=1&LAN=DE A1 Peng, Jing A1 Li, Biao A1 Qi, Fujun A1 Chen, Yu A1 Liao, Yuxiang A1 Man, Li YR 2022 SN 2693-289X K1 Couplings K1 Power transmission lines K1 Modal analysis K1 Stability criteria K1 Voltage K1 Power system stability K1 Mathematical models K1 electro-thermal coupling K1 modal analysis K1 style K1 minimum eigenvalue K1 participation factor SP 1267 OP 1271 LK http://dx.doi.org/https://doi.org/10.1109/ITOEC53115.2022.9734624 DO https://doi.org/10.1109/ITOEC53115.2022.9734624 SF ELIB - SuUB Bremen
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