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Capacitor Under Pad for Small Area Integration of High-Spee..:

, In: 2022 International Conference on Electronics, Information, and Communication (ICEIC),
Tsuchiya, Akira ; Inoue, Toshiyuki ; Kishine, Keiji... - p. 1-4 , 2022
Link: https://doi.org/10.1109/ICEIC54506.2022.9748827