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EMC related Handle-Wafer Backside Effects in a 180nm SOI-Te..:

, In: 2021 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo),
Nuernbergk, Dirk M. ; Knoll, Mario ; Heinrich, Klaus. - p. 70-74 , 2022
Link: https://doi.org/10.1109/EMCCompo52133.2022.9758589