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1 Ergebnisse
1
Resonance Property of a Novel Vertical Substrate Integrated..:
, In:
2021 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
,
Feng, Yu-Ru
;
Xiao, Qi-Han
;
Chen, Liang-Jin
... - p. 13-15 , 2022
Link:
https://doi.org/10.1109/EMCCompo52133.2022.9758614
RT T1
2021 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
: T1
Resonance Property of a Novel Vertical Substrate Integrated Waveguide
UL https://suche.suub.uni-bremen.de/peid=ieee-9758614&Exemplar=1&LAN=DE A1 Feng, Yu-Ru A1 Xiao, Qi-Han A1 Chen, Liang-Jin A1 Wei, Xing-Chang A1 Luo, Cong-De A1 Zhang, Zhi-Ying YR 2022 SN 2575-6893 K1 Time-frequency analysis K1 Solid modeling K1 Three-dimensional displays K1 Printed circuits K1 Resonant frequency K1 Electromagnetic waveguides K1 Predictive models K1 Substrate integrated waveguide K1 resonant frequency K1 modal field SP 13 OP 15 LK http://dx.doi.org/https://doi.org/10.1109/EMCCompo52133.2022.9758614 DO https://doi.org/10.1109/EMCCompo52133.2022.9758614 SF ELIB - SuUB Bremen
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