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1 Ergebnisse
1
Failure Strength Analysis and Young Modulus Assessment of 4..:
, In:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Vinciguerra, Vincenzo
;
Landi, Antonio
;
Hintermaier, Herbert
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/EuroSimE54907.2022.9758855
RT T1 <cTitle>2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Failure Strength Analysis and Young Modulus Assessment of 4H-SiC through a Ball on Ring Test</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9758855&Exemplar=1&LAN=DE A1 Vinciguerra, Vincenzo A1 Landi, Antonio A1 Hintermaier, Herbert A1 Badala, Paolo A1 Klug, Gerald A1 Sitta, Alessandro A1 Calabretta, Michele A1 Bassi, Anna A1 Renna, Marco A1 Messina, Angelo Alberto YR 2022 K1 Micromechanical devices K1 Young's modulus K1 Silicon carbide K1 Automotive applications K1 Bending K1 Mechanical variables measurement K1 Mathematical models K1 4H-SiC K1 ball-on-ring K1 failure strength K1 equivalent Young's Modulus SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE54907.2022.9758855 DO https://doi.org/10.1109/EuroSimE54907.2022.9758855 SF ELIB - SuUB Bremen
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