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1 Ergebnisse
1
A Simulation-Based Assessment of Print Accuracy for Microel..:
, In:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Thalhamer, A.
;
Fuchs, P.
;
Strohmeier, L.
.. - p. 1-11 , 2022
Link:
https://doi.org/10.1109/EuroSimE54907.2022.9758869
RT T1 <cTitle>2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9758869&Exemplar=1&LAN=DE A1 Thalhamer, A. A1 Fuchs, P. A1 Strohmeier, L. A1 Hasil, S. A1 Wolfberger, A. YR 2022 K1 Geometry K1 Solid modeling K1 Electric potential K1 Three-dimensional displays K1 Curing K1 Predictive models K1 Three-dimensional printing SP 1 OP 11 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE54907.2022.9758869 DO https://doi.org/10.1109/EuroSimE54907.2022.9758869 SF ELIB - SuUB Bremen
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