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Packaged Thermoelectric Generator with High-aspect-ratio Th..:

, In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Rao, Yongchen ; Xu, Chu ; Bechtold, Tamara. - p. 1-4 , 2022
Link: https://doi.org/10.1109/EuroSimE54907.2022.9758879