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1 Ergebnisse
1
Design Optimization for Passivation Crack Improvement in Po..:
, In:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Fan, Haibo
;
Zhou, Zhou
;
Shi, Yuning
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/EuroSimE54907.2022.9758887
RT T1 <cTitle>2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Design Optimization for Passivation Crack Improvement in Power Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9758887&Exemplar=1&LAN=DE A1 Fan, Haibo A1 Zhou, Zhou A1 Shi, Yuning A1 Shiu, Ivan A1 Yang, Jun A1 Chen, Haibin YR 2022 K1 Performance evaluation K1 Thermal expansion K1 Aluminum K1 Thermomechanical processes K1 Silicon nitride K1 Electromagnetic compatibility K1 Reliability engineering SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE54907.2022.9758887 DO https://doi.org/10.1109/EuroSimE54907.2022.9758887 SF ELIB - SuUB Bremen
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