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In-situ reliability monitoring of power packages using a Th..:

, In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),

Martin, H. A. ; Sattari, R. ; Smits, E. C. P.... - p. 1-10 , 2022

Link: https://doi.org/10.1109/EuroSimE54907.2022.9758913

RT 
T1 <cTitle>2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>In-situ reliability monitoring of power packages using a Thermal Test Chip</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-9758913&Exemplar=1&LAN=DE
				
A1 Martin, H. A.
A1 Sattari, R.
A1 Smits, E. C. P.
A1 van Zeijl, H. W.
A1 van Driel, W. D.
A1 Zhang, G. Q.
YR 2022
K1 Temperature measurement
K1 Heating systems
K1 Semiconductor device measurement
K1 Analytical models
K1 Computational modeling
K1 Electronic packaging thermal management
K1 Thermal analysis
K1 Reliability of power electronics
K1 In-situ analysis on reliability monitoring
K1 Transient thermal measurements
K1 Thermal Test Chips
K1 Thermal Compact Modelling
K1 Cauer electro-thermal model
K1 Von-Neumann stability criterion
SP 1
OP 10
LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE54907.2022.9758913
DO https://doi.org/10.1109/EuroSimE54907.2022.9758913
SF ELIB - SuUB Bremen

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