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1 Ergebnisse
1
BGA solder strain prediction using an Artificial Neural Net..:
, In:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Ferrando-Villalba, Pablo
;
Vandevelde, Bart
- p. 1-7 , 2022
Link:
https://doi.org/10.1109/EuroSimE54907.2022.9758918
RT T1 <cTitle>2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>BGA solder strain prediction using an Artificial Neural Network regressor</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9758918&Exemplar=1&LAN=DE A1 Ferrando-Villalba, Pablo A1 Vandevelde, Bart YR 2022 K1 Support vector machines K1 Micromechanical devices K1 Artificial neural networks K1 Response surface methodology K1 Microelectronics K1 Finite element analysis K1 Reliability SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE54907.2022.9758918 DO https://doi.org/10.1109/EuroSimE54907.2022.9758918 SF ELIB - SuUB Bremen
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