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1 Ergebnisse
1
Novel methodology for temperature-aware electromigration as..:
, In:
2022 IEEE International Reliability Physics Symposium (IRPS)
,
Kteyan, A.
;
Sukharev, V.
;
Yi, Y.
. - p. 1-10 , 2022
Link:
https://doi.org/10.1109/IRPS48227.2022.9764415
RT T1
2022 IEEE International Reliability Physics Symposium (IRPS)
: T1
Novel methodology for temperature-aware electromigration assessment in on-chip power grid: simulations and experimental validation (Invited)
UL https://suche.suub.uni-bremen.de/peid=ieee-9764415&Exemplar=1&LAN=DE A1 Kteyan, A. A1 Sukharev, V. A1 Yi, Y. A1 Kim, C. YR 2022 SN 1938-1891 K1 Temperature measurement K1 Atomic measurements K1 Resistance K1 Temperature distribution K1 Analytical models K1 Voltage measurement K1 Threshold voltage K1 Reliability theory K1 failure analysis K1 power grids K1 stress K1 thermal analysis SP 1 OP 10 LK http://dx.doi.org/https://doi.org/10.1109/IRPS48227.2022.9764415 DO https://doi.org/10.1109/IRPS48227.2022.9764415 SF ELIB - SuUB Bremen
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