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1 Ergebnisse
1
Reflow soldering in a heterogeneous device environment for ..:
, In:
2022 First International Conference on Electrical, Electronics, Information and Communication Technologies (ICEEICT)
,
KT, Oommen Tharakan
;
Verghis, Sudhir George
- p. 01-08 , 2022
Link:
https://doi.org/10.1109/ICEEICT53079.2022.9768629
RT T1
2022 First International Conference on Electrical, Electronics, Information and Communication Technologies (ICEEICT)
: T1
Reflow soldering in a heterogeneous device environment for Aerospace applications
UL https://suche.suub.uni-bremen.de/peid=ieee-9768629&Exemplar=1&LAN=DE A1 KT, Oommen Tharakan A1 Verghis, Sudhir George YR 2022 K1 Wiring K1 Resistors K1 Procurement K1 Military standards K1 Capacitors K1 Sociology K1 Lead K1 Reflow profile K1 Shear strength K1 Inter-metallic bonds K1 Solder voids SP 01 OP 08 LK http://dx.doi.org/https://doi.org/10.1109/ICEEICT53079.2022.9768629 DO https://doi.org/10.1109/ICEEICT53079.2022.9768629 SF ELIB - SuUB Bremen
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