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1 Ergebnisse
1
Packaging and Characterization of a Novel 7.2kV/85A SiC Aus..:
, In:
2022 IEEE Applied Power Electronics Conference and Exposition (APEC)
,
Tong, Junhong
;
Yu, Ruiyang
;
Sen, Soumik
. - p. 1720-1724 , 2022
Link:
https://doi.org/10.1109/APEC43599.2022.9773740
RT T1 <cTitle>2022 IEEE Applied Power Electronics Conference and Exposition (APEC)</cTitle>: T1 <Title>Packaging and Characterization of a Novel 7.2kV/85A SiC Austin SuperMOS Half-Bridge Intelligent Power Module (IPM)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9773740&Exemplar=1&LAN=DE A1 Tong, Junhong A1 Yu, Ruiyang A1 Sen, Soumik A1 Huang, Alex Q. YR 2022 SN 2470-6647 K1 Inductance K1 Silicon carbide K1 Power supplies K1 Thermal resistance K1 Multichip modules K1 Switches K1 Electronic packaging thermal management K1 intelligent power module K1 packaging K1 direct bonded copper SP 1720 OP 1724 LK http://dx.doi.org/https://doi.org/10.1109/APEC43599.2022.9773740 DO https://doi.org/10.1109/APEC43599.2022.9773740 SF ELIB - SuUB Bremen
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