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1 Ergebnisse
1
Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers:
, In:
2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
,
Malik, Muhammad Hassan
;
Rauter, Lukas
;
Zangl, Hubert
.. - p. 1-4 , 2022
Link:
https://doi.org/10.1109/FLEPS53764.2022.9781561
RT T1
2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
: T1
Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers
UL https://suche.suub.uni-bremen.de/peid=ieee-9781561&Exemplar=1&LAN=DE A1 Malik, Muhammad Hassan A1 Rauter, Lukas A1 Zangl, Hubert A1 Binder, Alfred A1 Roshanghias, Ali YR 2022 K1 Contacts K1 Bending K1 Stability analysis K1 Ink jet printing K1 Integrated circuit reliability K1 Substrates K1 Stress K1 E-papers K1 Ultra-thin dies K1 Hybrid integration K1 Flip Chip K1 Anisotropic Conductive Film (ACP) K1 Inkjet Printing K1 Dynamic bending test SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/FLEPS53764.2022.9781561 DO https://doi.org/10.1109/FLEPS53764.2022.9781561 SF ELIB - SuUB Bremen
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