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1 Ergebnisse
1
Machine learning Assists on High Aspect Ratio Slit Trench E..:
, In:
2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
,
Chang, Yu-Fan
;
Lee, Hong-Ji
;
Chou, Fu-Hsing
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/ASMC54647.2022.9792507
RT T1 <cTitle>2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</cTitle>: T1 <Title>Machine learning Assists on High Aspect Ratio Slit Trench Etching in 3D NAND</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9792507&Exemplar=1&LAN=DE A1 Chang, Yu-Fan A1 Lee, Hong-Ji A1 Chou, Fu-Hsing A1 Lee, Shih-Chin A1 Chung, Yao-An A1 Lian, Nan-Tzu A1 Han, Tzung-Ting A1 Yang, Tahone A1 Chen, Kuang-Chao A1 Lu, Chih-Yuan YR 2022 SN 2376-6697 K1 Semiconductor device modeling K1 Three-dimensional displays K1 Databases K1 Artificial neural networks K1 Machine learning K1 Predictive models K1 Semiconductor device manufacture K1 slit etch K1 3D NAND K1 Neural Network (NN) SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ASMC54647.2022.9792507 DO https://doi.org/10.1109/ASMC54647.2022.9792507 SF ELIB - SuUB Bremen
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