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1 Ergebnisse
1
Reliability of Silicone and Epoxy Resin Encapsulated Power ..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Steiner, Felix
;
Wurst, Helge
;
Leyrer, Benjamin
... - p. 147-148 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795398
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Reliability of Silicone and Epoxy Resin Encapsulated Power Modules in HV-H3TRB tests with Thin-Resin coated Dice</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795398&Exemplar=1&LAN=DE A1 Steiner, Felix A1 Wurst, Helge A1 Leyrer, Benjamin A1 Ishikawa, Dai A1 Nakako, Hideo A1 Blank, Thomas YR 2022 K1 Semiconductor device measurement K1 Power measurement K1 Electric breakdown K1 Multichip modules K1 Epoxy resins K1 Materials reliability K1 Power electronics K1 power electronics packaging K1 silicone K1 epoxy K1 HV- H3TRB K1 insulation breakdown SP 147 OP 148 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795398 DO https://doi.org/10.23919/ICEP55381.2022.9795398 SF ELIB - SuUB Bremen
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