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1 Ergebnisse
1
A study of electromigration effect according to interposer ..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Jung, Cheong-Ha
;
Park, Jung-Rae
;
Seo, Seong Won
.. - p. 209-210 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795428
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>A study of electromigration effect according to interposer area effect</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795428&Exemplar=1&LAN=DE A1 Jung, Cheong-Ha A1 Park, Jung-Rae A1 Seo, Seong Won A1 Jo, Eunsol A1 Kim, Gu-Sung YR 2022 K1 Electromigration K1 Insertion loss K1 Bandwidth K1 Delays K1 Through-silicon vias K1 Electronics packaging K1 HBM K1 EM solver K1 TSV SP 209 OP 210 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795428 DO https://doi.org/10.23919/ICEP55381.2022.9795428 SF ELIB - SuUB Bremen
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