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1 Ergebnisse
1
Advanced Low Dk and High-Density Photo- Imageable Dielectri..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Nemoto, Tetsuya
;
Ooto, Junichi
;
Ito, Hirokazu
. - p. 119-120 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795456
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Advanced Low Dk and High-Density Photo- Imageable Dielectrics for RDL Interposer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795456&Exemplar=1&LAN=DE A1 Nemoto, Tetsuya A1 Ooto, Junichi A1 Ito, Hirokazu A1 Hasegawa, Koichi YR 2022 K1 Resistance K1 Image resolution K1 Dielectric constant K1 Life estimation K1 Delays K1 Reliability K1 Signal resolution K1 Low Dk K1 High resolution K1 RDL interposer K1 Signal delay SP 119 OP 120 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795456 DO https://doi.org/10.23919/ICEP55381.2022.9795456 SF ELIB - SuUB Bremen
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