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Effect of Substrate Thinning and Junction-Side Cooling on T..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Wilhelmi, F. ; Komatsu, Y. ; Yamaguchi, S.... - p. 145-146 , 2022
Link: https://doi.org/10.23919/ICEP55381.2022.9795473