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1 Ergebnisse
1
Copper-Copper Ultrasonic Bonding by Using Blue Laser-Sinter..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Kishida, S.
;
Takada, Y.
;
Yinan, Z.
.. - p. 61-62 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795481
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Copper-Copper Ultrasonic Bonding by Using Blue Laser-Sintered Copper Nanoparticles</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795481&Exemplar=1&LAN=DE A1 Kishida, S. A1 Takada, Y. A1 Yinan, Z. A1 Song, J.-M. A1 Yasuda, K. YR 2022 K1 Nanoparticles K1 Silicon carbide K1 Power lasers K1 Laser sintering K1 Laser modes K1 Acoustics K1 Copper K1 die bond K1 ultrasonic bonding K1 laser sintering K1 porous copper SP 61 OP 62 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795481 DO https://doi.org/10.23919/ICEP55381.2022.9795481 SF ELIB - SuUB Bremen
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