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1 Ergebnisse
1
Polishing Diamond Substrates using Gas Cluster Ion Beam (GC..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Wang, Junsha
;
Takeuchi, Kai
;
Kataoka, Izumi
. - p. 57-58 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795483
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Polishing Diamond Substrates using Gas Cluster Ion Beam (GCIB) Irradiation for the Direct Bonding to Power Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795483&Exemplar=1&LAN=DE A1 Wang, Junsha A1 Takeuchi, Kai A1 Kataoka, Izumi A1 Suga, Tadatomo YR 2022 K1 Radiation effects K1 Smoothing methods K1 Planarization K1 Diamond K1 Surface roughness K1 Silicon K1 Rough surfaces K1 CVD diamond K1 gas cluster ion beam K1 surface activated bonding K1 GaN SP 57 OP 58 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795483 DO https://doi.org/10.23919/ICEP55381.2022.9795483 SF ELIB - SuUB Bremen
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