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Preparation of Ti/Si-Ti Base Nanofibers by Electrospinning ..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lin, Y. M. ; Chao, Y. C. ; Chung, C. L. - p. 183-184 , 2022
Link: https://doi.org/10.23919/ICEP55381.2022.9795495