I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Evaluation on Process-induced Warpage of Novel Fan-Out Wafe..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Yu, C. F.
;
Huang, Y. W.
;
Ouyang, T. Y.
.. - p. 195-196 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795498
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Evaluation on Process-induced Warpage of Novel Fan-Out Wafer Level Packaging using TSV Interposer-First Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795498&Exemplar=1&LAN=DE A1 Yu, C. F. A1 Huang, Y. W. A1 Ouyang, T. Y. A1 Cheng, S. F. A1 Hsiao, C. C. YR 2022 K1 Semiconductor device modeling K1 Temperature measurement K1 Parametric study K1 Glass K1 Predictive models K1 Optical variables measurement K1 Silicon K1 Fan-out wafer level packaging (FOWLP) K1 Cu through silicon via (TSV) K1 Finite element simulation K1 Process-induce Warpage K1 Response surface methodology SP 195 OP 196 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795498 DO https://doi.org/10.23919/ICEP55381.2022.9795498 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
