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1 Ergebnisse
1
Estimation of Switching Transients and Power Losses of SiC-..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Liu, Yan-Cheng
;
Cheng, Hsien-Chie
;
Lin, Hsin-Han
... - p. 159-160 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795500
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Estimation of Switching Transients and Power Losses of SiC-based Power MOSFET Inverter Using Electromagnetic-circuit Co-simulation during Six-step Commutation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795500&Exemplar=1&LAN=DE A1 Liu, Yan-Cheng A1 Cheng, Hsien-Chie A1 Lin, Hsin-Han A1 Chiou, Shian-Chiau A1 Wu, Sheng-Tai A1 Chang, Tao-Chih YR 2022 K1 Space vector pulse width modulation K1 Semiconductor device modeling K1 MOSFET K1 Silicon carbide K1 Switching frequency K1 Switches K1 Inverters K1 Silicon Carbide K1 Power Integrated Module K1 Switching Transient K1 Electromagnetic-circuit Simulation K1 Double Pulse Test SP 159 OP 160 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795500 DO https://doi.org/10.23919/ICEP55381.2022.9795500 SF ELIB - SuUB Bremen
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