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1 Ergebnisse
1
Efficient heat dissipation from β-Ga2O3 film directly bonde..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Matsumae, T.
;
Kurashima, Y.
;
Takagi, H.
... - p. 99-100 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795505
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Efficient heat dissipation from β-Ga2O3 film directly bonded on diamond substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795505&Exemplar=1&LAN=DE A1 Matsumae, T. A1 Kurashima, Y. A1 Takagi, H. A1 Umezawa, H. A1 Watanabe, H. A1 Ito, T. A1 Higurashi, E. YR 2022 K1 Heating systems K1 Thermal resistance K1 Thermal management K1 Thermal conductivity K1 Diamond K1 Power electronics K1 Bonding K1 Ga2O3 K1 diamond K1 thermal management K1 direct bonding SP 99 OP 100 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795505 DO https://doi.org/10.23919/ICEP55381.2022.9795505 SF ELIB - SuUB Bremen
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