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1 Ergebnisse
1
Bending Fatigue of Laser-sintered Copper Films on Plasma Bo..:
, In:
2022 International Conference on Electronics Packaging (ICEP)
,
Cheng, Wei-Hang
;
Jheng, Cing-Wun
;
Lee, Ming-Tsang
. - p. 47-48 , 2022
Link:
https://doi.org/10.23919/ICEP55381.2022.9795519
RT T1 <cTitle>2022 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Bending Fatigue of Laser-sintered Copper Films on Plasma Bombarded PI Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9795519&Exemplar=1&LAN=DE A1 Cheng, Wei-Hang A1 Jheng, Cing-Wun A1 Lee, Ming-Tsang A1 Song, Jenn-Ming YR 2022 K1 Surface resistance K1 Laser sintering K1 Bending K1 Conductivity K1 Fatigue K1 Surface roughness K1 Rough surfaces K1 laser sintering K1 plasma K1 bending fatigue K1 PI substrate SP 47 OP 48 LK http://dx.doi.org/https://doi.org/10.23919/ICEP55381.2022.9795519 DO https://doi.org/10.23919/ICEP55381.2022.9795519 SF ELIB - SuUB Bremen
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